GaN Semiconductor Devices Market Size Analysis 2022 To 2030

The global GaN semiconductor devices market size accounted for US$ 2.47 Bn in 2021 and is projected to reach around USD 19.3 Bn by 2030, growing at a CAGR of 29.3% from 2022 to 2030.

Report Summary

The global GaN semiconductor devices market report provides a Point-by-Point and In-Depth analysis of global market size, regional and country-level market size, market share, segmentation market growth, competitive landscape, sales analysis, opportunities analysis, strategic market growth analysis, the impact of domestic and global market key players, value chain optimization, trade regulations, recent developments, product launches, area marketplace expanding, and technological innovations.

The study offers a comprehensive analysis on diverse features, including production capacities, demand, product developments, revenue generation, and sales in the GaN semiconductor devices market across the globe.

A comprehensive estimate on the GaN semiconductor devices market has been provided through an optimistic scenario as well as a conservative scenario, taking into account the sales of GaN semiconductor devices during the forecast period. Price point comparison by region with global average price is also considered in the study.

Key Highlights:

Reports Coverage: It incorporates key market sections, key makers secured, the extent of items offered in the years considered, worldwide containerized GaN semiconductor devices market and study goals. Moreover, it contacts the division study gave in the report based on the sort of item and applications.

Market Outline: This area stresses the key investigations, market development rate, serious scene, market drivers, patterns, and issues notwithstanding the naturally visible pointers.

Market Production by Region: The report conveys information identified with import and fare, income, creation, and key players of every single local market contemplated are canvassed right now.

Also Read: Medical Equipment Financing Market Size Analysis 2022 To 2030

GaN Semiconductor Devices Market Report Scope 

GaN Semiconductor Devices Market  Players

The report includes the profiles of key GaN semiconductor devices market companies along with their SWOT analysis and market strategies. In addition, the report focuses on leading industry players with information such as company profiles, components and services offered, financial information, key development in past five years.

Major companies operating in this 

• Cree, Inc.
• Efficient Power Conversion Corporation
• Fujitsu Ltd.
• GaN Systems
• Infineon Technologies AG
• NexgenPowerSystems
• NXP Semiconductor
• Qorvo, Inc.
• Texas Instruments Incorporated
• Toshiba Corporation

Market Segmentation

By Product

• GaN Radio Frequency Devices
• Opto-semiconductors
• Power Semiconductors

By Component

• Transistor
• Diode
• Rectifier
• Power IC
• Others

By Wafer Size

• 2-inch
• 4-inch
• 6-inch
• 8-inch

By End Use

• Automotive
• Consumer Electronics
• Defense & Aerospace
• Healthcare
• Industrial & Power
• Information & Communication Technology
• Others

Regional Segmentation

• North America (U.S., Canada, Mexico)
• Europe (Germany, France, U.K., Italy, Spain, Rest of Europe)
• Asia-Pacific (China, Japan, India, Southeast Asia and Rest of APAC)
• Latin America (Brazil and Rest of Latin America)
• Middle East and Africa (GCC, North Africa, South Africa, Rest of MEA)

Research Methodology

Secondary Research

It involves company databases such as Hoover’s: This assists us to recognize financial information, the structure of the market participants and industry’s competitive landscape.

The secondary research sources referred in the process are as follows:

• Governmental bodies, and organizations creating economic policies
• National and international social welfare institutions
• Company websites, financial reports and SEC filings, broker and investor reports
• Related patent and regulatory databases
• Statistical databases and market reports
• Corporate Presentations, news, press release, and specification sheet of Manufacturers

Primary Research

Primary research includes face-to-face interviews, online surveys, and telephonic interviews.

• Means of primary research: Email interactions, telephonic discussions and Questionnaire-based research etc.
• In order to validate our research findings and analysis, we conduct primary interviews of key industry participants. Insights from primary respondents help in validating the secondary research findings. It also develops Research Team’s expertise and market understanding.

TABLE OF CONTENT

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on GaN Semiconductor Devices Market 

5.1. COVID-19 Landscape: GaN Semiconductor Devices Industry Impact

5.2. COVID 19 – Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global GaN Semiconductor Devices Market, By Product

8.1. GaN Semiconductor Devices Market, by Product, 2022-2030

8.1.1. GaN Radio Frequency Devices

8.1.1.1. Market Revenue and Forecast (2017-2030)

8.1.2. Opto-semiconductors

8.1.2.1. Market Revenue and Forecast (2017-2030)

8.1.3. Power Semiconductors

8.1.3.1. Market Revenue and Forecast (2017-2030)

Chapter 9. Global GaN Semiconductor Devices Market, By Component

9.1. GaN Semiconductor Devices Market, by Component, 2022-2030

9.1.1. Transistor

9.1.1.1. Market Revenue and Forecast (2017-2030)

9.1.2. Diode

9.1.2.1. Market Revenue and Forecast (2017-2030)

9.1.3. Rectifier

9.1.3.1. Market Revenue and Forecast (2017-2030)

9.1.4. Power IC

9.1.4.1. Market Revenue and Forecast (2017-2030)

9.1.5. Others

9.1.5.1. Market Revenue and Forecast (2017-2030)

Chapter 10. Global GaN Semiconductor Devices Market, By Wafer Size 

10.1. GaN Semiconductor Devices Market, by Wafer Size, 2022-2030

10.1.1. 2-inch

10.1.1.1. Market Revenue and Forecast (2017-2030)

10.1.2. 4-inch

10.1.2.1. Market Revenue and Forecast (2017-2030)

10.1.3. 6-inch

10.1.3.1. Market Revenue and Forecast (2017-2030)

10.1.4. 8-inch

10.1.4.1. Market Revenue and Forecast (2017-2030)

Chapter 11. Global GaN Semiconductor Devices Market, By End Use 

11.1. GaN Semiconductor Devices Market, by End Use, 2022-2030

11.1.1. Automotive

11.1.1.1. Market Revenue and Forecast (2017-2030)

11.1.2. Consumer Electronics

11.1.2.1. Market Revenue and Forecast (2017-2030)

11.1.3. Defense & Aerospace

11.1.3.1. Market Revenue and Forecast (2017-2030)

11.1.4. Healthcare

11.1.4.1. Market Revenue and Forecast (2017-2030)

11.1.5. Industrial & Power

11.1.5.1. Market Revenue and Forecast (2017-2030)

11.1.6. Information & Communication Technology

11.1.6.1. Market Revenue and Forecast (2017-2030)

11.1.7. Others

11.1.7.1. Market Revenue and Forecast (2017-2030)

Chapter 12. Global GaN Semiconductor Devices Market, Regional Estimates and Trend Forecast

12.1. North America

12.1.1. Market Revenue and Forecast, by Product (2017-2030)

12.1.2. Market Revenue and Forecast, by Component (2017-2030)

12.1.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.1.4. Market Revenue and Forecast, by End Use (2017-2030)

12.1.5. U.S.

12.1.5.1. Market Revenue and Forecast, by Product (2017-2030)

12.1.5.2. Market Revenue and Forecast, by Component (2017-2030)

12.1.5.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.1.5.4. Market Revenue and Forecast, by End Use (2017-2030)

12.1.6. Rest of North America

12.1.6.1. Market Revenue and Forecast, by Product (2017-2030)

12.1.6.2. Market Revenue and Forecast, by Component (2017-2030)

12.1.6.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.1.6.4. Market Revenue and Forecast, by End Use (2017-2030)

12.2. Europe

12.2.1. Market Revenue and Forecast, by Product (2017-2030)

12.2.2. Market Revenue and Forecast, by Component (2017-2030)

12.2.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.2.4. Market Revenue and Forecast, by End Use (2017-2030)

12.2.5. UK

12.2.5.1. Market Revenue and Forecast, by Product (2017-2030)

12.2.5.2. Market Revenue and Forecast, by Component (2017-2030)

12.2.5.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.2.5.4. Market Revenue and Forecast, by End Use (2017-2030)

12.2.6. Germany

12.2.6.1. Market Revenue and Forecast, by Product (2017-2030)

12.2.6.2. Market Revenue and Forecast, by Component (2017-2030)

12.2.6.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.2.6.4. Market Revenue and Forecast, by End Use (2017-2030)

12.2.7. France

12.2.7.1. Market Revenue and Forecast, by Product (2017-2030)

12.2.7.2. Market Revenue and Forecast, by Component (2017-2030)

12.2.7.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.2.7.4. Market Revenue and Forecast, by End Use (2017-2030)

12.2.8. Rest of Europe

12.2.8.1. Market Revenue and Forecast, by Product (2017-2030)

12.2.8.2. Market Revenue and Forecast, by Component (2017-2030)

12.2.8.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.2.8.4. Market Revenue and Forecast, by End Use (2017-2030)

12.3. APAC

12.3.1. Market Revenue and Forecast, by Product (2017-2030)

12.3.2. Market Revenue and Forecast, by Component (2017-2030)

12.3.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.3.4. Market Revenue and Forecast, by End Use (2017-2030)

12.3.5. India

12.3.5.1. Market Revenue and Forecast, by Product (2017-2030)

12.3.5.2. Market Revenue and Forecast, by Component (2017-2030)

12.3.5.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.3.5.4. Market Revenue and Forecast, by End Use (2017-2030)

12.3.6. China

12.3.6.1. Market Revenue and Forecast, by Product (2017-2030)

12.3.6.2. Market Revenue and Forecast, by Component (2017-2030)

12.3.6.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.3.6.4. Market Revenue and Forecast, by End Use (2017-2030)

12.3.7. Japan

12.3.7.1. Market Revenue and Forecast, by Product (2017-2030)

12.3.7.2. Market Revenue and Forecast, by Component (2017-2030)

12.3.7.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.3.7.4. Market Revenue and Forecast, by End Use (2017-2030)

12.3.8. Rest of APAC

12.3.8.1. Market Revenue and Forecast, by Product (2017-2030)

12.3.8.2. Market Revenue and Forecast, by Component (2017-2030)

12.3.8.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.3.8.4. Market Revenue and Forecast, by End Use (2017-2030)

12.4. MEA

12.4.1. Market Revenue and Forecast, by Product (2017-2030)

12.4.2. Market Revenue and Forecast, by Component (2017-2030)

12.4.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.4.4. Market Revenue and Forecast, by End Use (2017-2030)

12.4.5. GCC

12.4.5.1. Market Revenue and Forecast, by Product (2017-2030)

12.4.5.2. Market Revenue and Forecast, by Component (2017-2030)

12.4.5.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.4.5.4. Market Revenue and Forecast, by End Use (2017-2030)

12.4.6. North Africa

12.4.6.1. Market Revenue and Forecast, by Product (2017-2030)

12.4.6.2. Market Revenue and Forecast, by Component (2017-2030)

12.4.6.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.4.6.4. Market Revenue and Forecast, by End Use (2017-2030)

12.4.7. South Africa

12.4.7.1. Market Revenue and Forecast, by Product (2017-2030)

12.4.7.2. Market Revenue and Forecast, by Component (2017-2030)

12.4.7.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.4.7.4. Market Revenue and Forecast, by End Use (2017-2030)

12.4.8. Rest of MEA

12.4.8.1. Market Revenue and Forecast, by Product (2017-2030)

12.4.8.2. Market Revenue and Forecast, by Component (2017-2030)

12.4.8.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.4.8.4. Market Revenue and Forecast, by End Use (2017-2030)

12.5. Latin America

12.5.1. Market Revenue and Forecast, by Product (2017-2030)

12.5.2. Market Revenue and Forecast, by Component (2017-2030)

12.5.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.5.4. Market Revenue and Forecast, by End Use (2017-2030)

12.5.5. Brazil

12.5.5.1. Market Revenue and Forecast, by Product (2017-2030)

12.5.5.2. Market Revenue and Forecast, by Component (2017-2030)

12.5.5.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.5.5.4. Market Revenue and Forecast, by End Use (2017-2030)

12.5.6. Rest of LATAM

12.5.6.1. Market Revenue and Forecast, by Product (2017-2030)

12.5.6.2. Market Revenue and Forecast, by Component (2017-2030)

12.5.6.3. Market Revenue and Forecast, by Wafer Size (2017-2030)

12.5.6.4. Market Revenue and Forecast, by End Use (2017-2030)

Chapter 13. Company Profiles

13.1. Cree, Inc.

13.1.1. Company Overview

13.1.2. Product Offerings

13.1.3. Financial Performance

13.1.4. Recent Initiatives

13.2. Efficient Power Conversion Corporation

13.2.1. Company Overview

13.2.2. Product Offerings

13.2.3. Financial Performance

13.2.4. Recent Initiatives

13.3. Fujitsu Ltd.

13.3.1. Company Overview

13.3.2. Product Offerings

13.3.3. Financial Performance

13.3.4. Recent Initiatives

13.4. GaN Systems

13.4.1. Company Overview

13.4.2. Product Offerings

13.4.3. Financial Performance

13.4.4. Recent Initiatives

13.5. Infineon Technologies AG

13.5.1. Company Overview

13.5.2. Product Offerings

13.5.3. Financial Performance

13.5.4. Recent Initiatives

13.6. NexgenPowerSystems

13.6.1. Company Overview

13.6.2. Product Offerings

13.6.3. Financial Performance

13.6.4. Recent Initiatives

13.7. NXP Semiconductor

13.7.1. Company Overview

13.7.2. Product Offerings

13.7.3. Financial Performance

13.7.4. Recent Initiatives

13.8. Qorvo, Inc.

13.8.1. Company Overview

13.8.2. Product Offerings

13.8.3. Financial Performance

13.8.4. Recent Initiatives

13.9. Texas Instruments Incorporated

13.9.1. Company Overview

13.9.2. Product Offerings

13.9.3. Financial Performance

13.9.4. Recent Initiatives

13.10. Toshiba Corporation

13.10.1. Company Overview

13.10.2. Product Offerings

13.10.3. Financial Performance

13.10.4. Recent Initiatives

Chapter 14. Research Methodology

14.1. Primary Research

14.2. Secondary Research

14.3. Assumptions

Chapter 15. Appendix

15.1. About Us

15.2. Glossary of Terms

Thanks for reading you can also get individual chapter-wise sections or region-wise report versions such as North America, Europe, or the Asia Pacific.

Download Access to a Free Copy of Our Latest Sample Report@ https://www.precedenceresearch.com/sample/2363

Contact Us:

Mr. Alex

Sales Manager

Call: +1 9197 992 333

Email: sales@precedenceresearch.com

Web: https://www.precedenceresearch.com