by According to the industry experts, The passive & interconnecting electronic components market size is projected to reach around US$ 273.9 billion by 2030 from USD 176 billion in 2021 growing at a CAGR of 5.6% from 2021 to 2030. The report contains 150+ pages with detailed analysis.
The base year for the study has been considered 2021, the historic year 2019 and 2020, the forecast period considered is from 2021 to 2030. The passive and interconnecting electronic components market is analyzed on the basis of value (US$ Million), volume (Unit), and price (US$/Unit).
Passive and interconnecting electronic components are used as essential parts of electronic devices, such as smartphones, computers, electrical home appliances, and gaming consoles. They are considered the backbone of computers, consumer electronics, telecommunications, and many other industries. It includes sockets, connectors, printed circuit boards, relays, switches, and many others.
Passive & Interconnecting Electronic Components Report Highlights
- The capacitor passive segment accounted for more than 36% revenue share in 2020.
- The consumer electronics application segment of the Passive And Interconnecting Electronic Components Market is estimated to lead the market with a market share of more than41% in 2020.
- By Geography, Asia Pacific is expected to lead the market contributing a revenue share of more than USD 97.1 billion in 2021 owing the presence of major market players in the region.
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Passive & Interconnecting Electronic Components Market Scope
This market report studies market dynamics, status and outlook especially in North America, Europe and Asia-Pacific, Latin America, the Middle East and Africa. This research report offers scenario and forecast (revenue/volume), and categorizes the market by key players and various segment. This report also studies global market prominence, competitive landscape, market share, growth rates market dynamics such as drivers, restraints and opportunities, and distributors and sales channels.
This research study also integrates Industry Chain analysis and Porter’s Five Forces Analysis. Further, this report offers a competitive scenario that comprises collaborations, market concentration rate and expansions, mergers & acquisitions undertaken by companies.
Crucial factors accountable for Passive & Interconnecting Electronic Components market growth are:
- Rapid surge in demand for consumer electronics products will trigger the market growth.
- The increase in demand for 5G network services.
- The integration of internet of things (IoT) and automation with the Passive And Interconnecting Electronic Components.
- Government initiative to encourage the development of robust 5G network infrastructure.
Regional Snapshots
The Asia Pacific region leads the Passive And Interconnecting Electronic Components Market contributing a revenue share of more than USD 97.1 billion in 2020 and is estimated to grow significantly during the forecast period due to the presence of major market players investing heavily for the development of the Passive And Interconnecting Electronic Components market. For instance, On 15th April 2021, Samsung Electro-Mechanics developed the world’s first ultra-small, high-capacity MLCC new product with the best performance, and is now establishing itself as the industry leader in the high added-value IT MLCC market. MLCC is a key component in electronic devices that regulates the steady flow of electric current within the circuit, and it’s crucial for products like smartphones, household appliances, and automobiles.
Passive & Interconnecting Electronic Components Market Dynamics
Driver
The rise in demand for the deployment of 5G network services across the world is a major factor that is estimated to drive the growth of the Passive And Interconnecting Electronic Components. Also, the integration of automation with the electronics components is yet another factor that fosters the market growth. For instance, On 16th September 2021, The new TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, have been released by AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions.
Restraint
The major restraining factor that will negatively impact the growth of the Passive And Interconnecting Electronic Components Market includes drop in the global commodity prices and the surge in complexity of the passive and interconnecting electronic components in order to ensure high functionality.
Opportunity
The desire for availing the remote communication facilities and the implementation of the 5G network infrastructure across the globe are the factors that is expected to find huge growth opportunities which will trigger the market growth.
Challenges
The increase in complexity of the passive and interconnecting electronic components in order to provide high functionality is the major challenge encountered by the passive and interconnecting electronic components market that is anticipated to hinder the market growth.
Recent Developments
- On 14th July 2021, A new 3-D interactive connectivity application has been released by AVX Corporation, a major manufacturer and provider of innovative electronic components and interconnect, sensor, control, and antenna systems. The new 3-D interactive interconnect application, which is available on the AVX website and can be accessed via computer, tablet, or smartphone, gives users several intuitive ways to access a comprehensive and visually engaging suite of product information for an extensive selection of its proven portfolio of board-to-board, wire-to-board, and wire-to-wire connectors, including application examples spanning seven market segments; interactive, animated, and annunciated, 3-D product renderings; and relevant product pages, datasheets, and catalogs.
- On 26th October 2021, The ADL3225VM inductors from TDK Corporation are now available for use in automobile Power over Coax (PoC) systems. These inductors, which have dimensions of 3.2 x 2.5 x 2.5 mm (L x W x H), are a tiny alternative for designers wanting to minimise vehicle weight as manufacturers add more sensors and cameras to accommodate expanding automotive and advanced driver-assistance systems (ADAS) applications.
- On 21st September 2021, Fujitsu Components has introduced a line of USB dongles to complement its existing IoT products. The FWM8BLZ09x USB dongles, which have built-in Massive network connectivity, are a simple and cost-effective solution to add Wirepas Massive Mesh Anchor or Tag functionality to any equipment with a USB port. They can also provide Massive Mesh Sink functionality to any existing gateway that runs Wirepas software.
- On 29th June 2021, Fujitsu Components America, Inc. has introduced a new mesh network and multi-sensor unit family with built-in Wirepas Massive network connectivity and long battery life. The nodes make dense, large-scale network installations possible for a variety of industrial monitoring IoT applications in offices, factories, warehouses, hospitals, and schools, among other places.
- On 15th September 2021, Reality AI and Fujitsu Component Limited have established a partnership to provide Fujitsu Component’s contactless vibration sensor to manufacturing and industrial applications. Reality AI’s RealityCheck AD for industrial anomaly detection will be demonstrated live at the forthcoming Sensors Converge Expo in San Jose, CA, from September 21 to 23.
More Link: Semiconductor Market Revenue to Reach US$ 772 Billion by 2030
Passive & Interconnecting Electronic Components Key Players/Manufacturers
This report also provides detailed company profiles of the key market players. This research report also highlights the competitive landscape of the passive and interconnecting electronic components market and ranks noticeable companies as per their occurrence in diverse regions across the globe and crucial developments initiated by them in the market space. This research study also tracks and evaluates competitive developments, such as collaborations, partnerships, and agreements, mergers and acquisitions; novel product introductions and developments, promotion strategies and Research and Development (R&D) activities in the marketplace. The competitive profiling of these players includes business and financial overview, gross margin, production, sales, and recent developments which can aid in assessing competition in the market.
Some of the prominent players in the global passive and interconnecting electronic components market include:
AVX Corporation; Vishay Intertechnology, Inc.; Mouser Electronics, Inc.; Murata Manufacturing Co., Ltd.; TDK Corporation; Taiyo Yuden Co., Ltd.; Samsung Electro-Mechanics; Hosiden Corporation.; Yageo Corporation; Nichicon Corporation; Panasonic Corporation; Fujitsu Component Limited; Fenghua (HK) Electronics Ltd.; Rohm Co., Ltd.; United Chemi-Con; TE connectivity; and Molex Incorporated.
Passive & Interconnecting Electronic Components Market Segments Covered
By Component
- Passive
- Resistors
- Capacitors
- Inductors
- Transformers
- Diode
- Interconnecting
- PCB
- Connectors/Sockets
- Switches
- Relays
- Others
By Application
- Consumer Electronics
- Mobile Phones
- Personal Computers
- Home Appliances
- Audio and Video Systems
- Storage Devices
- Others
- IT & Telecommunication
- Telecom Equipment
- Networking Devices
- Automotive
- Driver Assistance Systems
- Infotainment Systems
- Others
- Industrial
- Mechatronics and robotics,
- Power Electronics
- Photo Voltaic Systems
- Others
- Aerospace & Defense
- Aircraft systems
- Military Radars
- Others
- Healthcare
- Medical Imaging Equipment
- Consumer Medical Devices
- Others
- Others
By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Russia
- Italy
- Spain
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Research Objective
- To provide a comprehensive analysis of the passive and interconnecting electronic components industry and its sub-segments in the global market, thereby providing a detailed structure of the industry
- To provide detailed insights into factors driving and restraining the growth of this global market
- To provide a distribution chain analysis/value chain for the this market
- To estimate the market size of the global passive and interconnecting electronic components market where 2019 would be the historical period, 2020 shall be the base year, and 2020 to 2027 will be the forecast period for the study
- To provide strategic profiling of key companies (manufacturers and distributors) present across the globe, and comprehensively analyze their competitiveness/competitive landscape in this market
- To analyze the global market in four main geographies, namely, North America, Europe, Asia-Pacific, and the Rest of the World
- To provide country-wise market value analysis for various segments of the passive and interconnecting electronic components
TABLE OF CONTENT
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Passive and Interconnecting Electronic Components Market
5.1. COVID-19 Landscape: Passive and Interconnecting Electronic Components Industry Impact
5.2. COVID 19 – Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Passive and Interconnecting Electronic Components Market, By Component
8.1. Passive and Interconnecting Electronic Components Market, by Component, 2021-2030
8.1.1. Passive
8.1.1.1. Market Revenue and Forecast (2019-2030)
8.1.2. Interconnecting
8.1.2.1. Market Revenue and Forecast (2019-2030)
Chapter 9. Global Passive and Interconnecting Electronic Components Market, By Application
9.1. Passive and Interconnecting Electronic Components Market, by Application, 2021-2030
9.1.1. Consumer Electronics
9.1.1.1. Market Revenue and Forecast (2019-2030)
9.1.2. IT & Telecommunication
9.1.2.1. Market Revenue and Forecast (2019-2030)
9.1.3. Automotive
9.1.3.1. Market Revenue and Forecast (2019-2030)
9.1.4. Industrial
9.1.4.1. Market Revenue and Forecast (2019-2030)
9.1.5. Aerospace & Defense
9.1.5.1. Market Revenue and Forecast (2019-2030)
9.1.6. Healthcare
9.1.6.1. Market Revenue and Forecast (2019-2030)
9.1.7. Others
9.1.7.1. Market Revenue and Forecast (2019-2030)
Chapter 10. Global Passive and Interconnecting Electronic Components Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Component (2019-2030)
10.1.2. Market Revenue and Forecast, by Application (2019-2030)
10.1.3. U.S.
10.1.3.1. Market Revenue and Forecast, by Component (2019-2030)
10.1.3.2. Market Revenue and Forecast, by Application (2019-2030)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Forecast, by Component (2019-2030)
10.1.4.2. Market Revenue and Forecast, by Application (2019-2030)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Component (2019-2030)
10.2.2. Market Revenue and Forecast, by Application (2019-2030)
10.2.3. UK
10.2.3.1. Market Revenue and Forecast, by Component (2019-2030)
10.2.3.2. Market Revenue and Forecast, by Application (2019-2030)
10.2.4. Germany
10.2.4.1. Market Revenue and Forecast, by Component (2019-2030)
10.2.4.2. Market Revenue and Forecast, by Application (2019-2030)
10.2.5. France
10.2.5.1. Market Revenue and Forecast, by Component (2019-2030)
10.2.5.2. Market Revenue and Forecast, by Application (2019-2030)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Forecast, by Component (2019-2030)
10.2.6.2. Market Revenue and Forecast, by Application (2019-2030)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Component (2019-2030)
10.3.2. Market Revenue and Forecast, by Application (2019-2030)
10.3.3. India
10.3.3.1. Market Revenue and Forecast, by Component (2019-2030)
10.3.3.2. Market Revenue and Forecast, by Application (2019-2030)
10.3.4. China
10.3.4.1. Market Revenue and Forecast, by Component (2019-2030)
10.3.4.2. Market Revenue and Forecast, by Application (2019-2030)
10.3.5. Japan
10.3.5.1. Market Revenue and Forecast, by Component (2019-2030)
10.3.5.2. Market Revenue and Forecast, by Application (2019-2030)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Forecast, by Component (2019-2030)
10.3.6.2. Market Revenue and Forecast, by Application (2019-2030)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Component (2019-2030)
10.4.2. Market Revenue and Forecast, by Application (2019-2030)
10.4.3. GCC
10.4.3.1. Market Revenue and Forecast, by Component (2019-2030)
10.4.3.2. Market Revenue and Forecast, by Application (2019-2030)
10.4.4. North Africa
10.4.4.1. Market Revenue and Forecast, by Component (2019-2030)
10.4.4.2. Market Revenue and Forecast, by Application (2019-2030)
10.4.5. South Africa
10.4.5.1. Market Revenue and Forecast, by Component (2019-2030)
10.4.5.2. Market Revenue and Forecast, by Application (2019-2030)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Forecast, by Component (2019-2030)
10.4.6.2. Market Revenue and Forecast, by Application (2019-2030)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Component (2019-2030)
10.5.2. Market Revenue and Forecast, by Application (2019-2030)
10.5.3. Brazil
10.5.3.1. Market Revenue and Forecast, by Component (2019-2030)
10.5.3.2. Market Revenue and Forecast, by Application (2019-2030)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Forecast, by Component (2019-2030)
10.5.4.2. Market Revenue and Forecast, by Application (2019-2030)
Chapter 11. Company Profiles
11.1. AVX Corporation
11.1.1. Company Overview
11.1.2. Component Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. Vishay Intertechnology, Inc
11.2.1. Company Overview
11.2.2. Component Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. Mouser Electronics, Inc
11.3.1. Company Overview
11.3.2. Component Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. Manufacturing Co., Ltd.
11.4.1. Company Overview
11.4.2. Component Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. TDK Corporation
11.5.1. Company Overview
11.5.2. Component Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. Taiyo Yuden Co., Ltd.
11.6.1. Company Overview
11.6.2. Component Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Samsung Electro-Mechanics
11.7.1. Company Overview
11.7.2. Component Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. Hosiden Corporation
11.8.1. Company Overview
11.8.2. Component Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. Yageo Corporation
11.9.1. Company Overview
11.9.2. Component Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. Nichicon Corporation
11.10.1. Company Overview
11.10.2. Component Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
Thanks for reading you can also get individual chapter-wise sections or region-wise report versions such as North America, Europe, or the Asia Pacific.
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