October 4, 2024
Semiconductor Production Equipment

Semiconductor Production Equipment Market Size Analysis 2021-2030

According to the industry experts, The global semiconductor production equipment market was valued at USD 63 billion in 2021 and is projected to reach US$ 142.4 billion by 2030, growing at a CAGR of 9.5% from 2021 to 2030. The report contains 150+ pages with detailed analysis.

The base year for the study has been considered 2021, the historic year 2019 and 2020, the forecast period considered is from 2021 to 2030. The semiconductor production equipment market is analyzed on the basis of value (US$ Million), volume (Unit), and price (US$/Unit).

Semiconductor Manufacturing Equipment is a term that refers to the machinery that is used to make semiconductors. The semiconductor business is enormous, with many different uses. The semiconductor manufacturing equipment sector is classified into two categories: front-end and back-end. Semiconductor fabrication equipment is a critical component in the fabrication process. Fabricating semiconductors is a time-consuming process that necessitates the use of a high-quality manufacturing facility. Semiconductor manufacturing equipment includes oxidation systems, epitaxial reactors, diffusion systems, ion implantation equipment, physical vapour deposition systems, chemical vapour deposition systems, photolithography equipment, and etching equipment. In 2020, the Semiconductor Production Equipment Market was valued at US$ 62https://www.precedenceresearch.com/sample/1367.5 billion and is expected to grow at a CAGR of 9.5% over the forecast period.

Download the Sample Pages of this Report for Better Understanding (Including TOC, List of Tables & Figures, and Chart) @ https://www.precedenceresearch.com/sample/1367

Semiconductor Production Equipment Market Scope

This market report studies market dynamics, status and outlook especially in North America, Europe and Asia-Pacific, Latin America, the Middle East and Africa. This research report offers scenario and forecast (revenue/volume), and categorizes the market by key players and various segment. This report also studies global market prominence, competitive landscape, market share, growth rates market dynamics such as drivers, restraints and opportunities, and distributors and sales channels.

This research study also integrates Industry Chain analysis and Porter’s Five Forces Analysis. Further, this report offers a competitive scenario that comprises collaborations, market concentration rate and expansions, mergers & acquisitions undertaken by companies.

Crucial factors accountable for market growth are:

  • Rapid growth of consumer electronic product fosters the market growth.
  • Rise in middle class lifestyle and surge in desire to use smart electronic devices.
  • The growth in demand for mobile phones.
  • The integration electronics devices with the Internet of Things (IoT).
Semiconductor Production Equipment Report Highlights
  • The front-end semiconductor production equipment segment accounted for more than 60% revenue share in 2020.
  • The 2.5D packaging architecture segment of the Semiconductor Production Equipment Market is estimated to lead the market with a market share of more than35% in 2020.
  • By Geography, Asia Pacific is expected to lead the market contributing more than 75% revenue share in 2020 owing to favorable economic conditions and low labour costs in this region.
Semiconductor Production Equipment Market Dynamics

Driver

Consumer electronics is one of the most essential industries that is completely reliant on the semiconductor sector. Consumer electronics is a significant element of the electronics industry, and it contributes to the growth of the global semiconductor manufacturing equipment market. The number of foundries has increased globally due to rising demand for consumer electrical devices. Changing chip sizes and inventive layouts in various electronic devices have expanded semiconductor demand, resulting in large profits for semiconductor equipment producers. For instance, On 8th September 2021, Applied Materials, Inc. has announced new technologies and capabilities to aid customers in accelerating their heterogeneous chip design and integration technology roadmaps.

Restraint

Tiny dust particles disrupt the entire semiconductor production and fabrication process, necessitating the usage of a clean atmosphere and clean equipment. Furthermore, manufacturing faults generate supply delays, which can lead to additional losses such as order cancellations and client moves to other providers. The pattern complexity increases as the number of patterns on a chip grows due to its limited size. For correct data flow to the chip, this necessitates great precision. The demand for size reduction has increased the complexity of wafers, which has resulted in a high density of semiconductor chips, lowering the lithography wavelength. Photomasks and wafers will become more complicated as node sizes shrink, necessitating the purchase of new semiconductor manufacturing equipment. All of these issues stifle the semiconductor manufacturing equipment market’s expansion.

Opportunity

The surge in demand for electronic products across the globe is expected to create huge opportunities for the growth of the Semiconductor Manufacturing Equipment Market.

Challenges

In semiconductor manufacturing, electrostatic charge poses problems, making it difficult to maintain high yield and product quality. A failure in static charge regulation can result in electrostatic discharge (ESD) damage, particle contamination, and equipment problems. These problems can be found in photomask fabrication, silicon wafer fabrication, back-end assembly, packaging, front-end device fabrication, and testing, among other semiconductor manufacturing processes. All these attributes are expected to be a major challenge in the growth of the Semiconductor Manufacturing Equipment Market.

Read Also: Preclinical CRO Market Size Anticipated To Reach US$ 9.6 Bn By 2030

Key Players/Manufacturers

This report also provides detailed company profiles of the key market players. This research report also highlights the competitive landscape of the semiconductor production equipment market and ranks noticeable companies as per their occurrence in diverse regions across the globe and crucial developments initiated by them in the market space. This research study also tracks and evaluates competitive developments, such as collaborations, partnerships, and agreements, mergers and acquisitions; novel product introductions and developments, promotion strategies and Research and Development (R&D) activities in the marketplace. The competitive profiling of these players includes business and financial overview, gross margin, production, sales, and recent developments which can aid in assessing competition in the market.

Some of the prominent players in the global semiconductor production equipment market include:

Tokyo Electron Limited, Applied Materials, Inc., ASML, LAM RESEARCH CORPORATION, and Canon Inc.

Semiconductor Production Equipment Market Share, By Region, 2020 (%)

Market Segments Covered

By Product

  • Front-end equipment
    • Lithography
    • Polishing & grinding
    • Water surface conditioning equipment
    • Others
  • Back-end equipment
    • Wafer manufacturing equipment
    • Assembly & packaging equipment
    • Test equipment
    • Others

By Dimension

  • 2D
  • 2.5D
  • 3D

By Supply Chain Process

  • OSAT
  • IDM
  • Foundry

By Geography

  • North America
  • Europe
  • Asia Pacific
  • LAMEA

Research Objective

  • To provide a comprehensive analysis of the semiconductor production equipment industry and its sub-segments in the global market, thereby providing a detailed structure of the industry
  • To provide detailed insights into factors driving and restraining the growth of this global market
  • To provide a distribution chain analysis/value chain for the this market
  • To estimate the market size of the global semiconductor production equipment market where 2019 would be the historical period, 2020 shall be the base year, and 2020 to 2027 will be the forecast period for the study
  • To provide strategic profiling of key companies (manufacturers and distributors) present across the globe, and comprehensively analyze their competitiveness/competitive landscape in this market
  • To analyze the global market in four main geographies, namely, North America, Europe, Asia-Pacific, and the Rest of the World
  • To provide country-wise market value analysis for various segments of the semiconductor production equipment

TABLE OF CONTENT

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Semiconductor Production Equipment Market 

5.1. COVID-19 Landscape: Semiconductor Production Equipment Industry Impact

5.2. COVID 19 – Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Semiconductor Production Equipment Market, By Product

8.1. Semiconductor Production Equipment Market, by Product Type, 2021-2030

8.1.1. Front-end equipment (Front-end equipment, Lithography, Polishing & grinding, Water surface conditioning equipment, Others)

8.1.1.1. Market Revenue and Forecast (2019-2030)

8.1.2. Back-end equipment (Wafer manufacturing equipment, Assembly & packaging equipment, Test equipment, Others)

8.1.2.1. Market Revenue and Forecast (2019-2030)

Chapter 9. Global Semiconductor Production Equipment Market, By Dimension

9.1. Semiconductor Production Equipment Market, by Dimension, 2021-2030

9.1.1. 2D

9.1.1.1. Market Revenue and Forecast (2019-2030)

9.1.2. 2.5D

9.1.2.1. Market Revenue and Forecast (2019-2030)

9.1.3. 3D

9.1.3.1. Market Revenue and Forecast (2019-2030)

Chapter 10. Global Semiconductor Production Equipment Market, By Supply Chain Process 

10.1. Semiconductor Production Equipment Market, by Supply Chain Process, 2021-2030

10.1.1. OSAT

10.1.1.1. Market Revenue and Forecast (2019-2030)

10.1.2. IDM

10.1.2.1. Market Revenue and Forecast (2019-2030)

10.1.3. Foundry

10.1.3.1. Market Revenue and Forecast (2019-2030)

Chapter 11. Global Semiconductor Production Equipment Market, Regional Estimates and Trend Forecast

11.1. North America

11.1.1. Market Revenue and Forecast, by Product (2019-2030)

11.1.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.1.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.1.4. U.S.

11.1.4.1. Market Revenue and Forecast, by Product (2019-2030)

11.1.4.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.1.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.1.5. Rest of North America

11.1.5.1. Market Revenue and Forecast, by Product (2019-2030)

11.1.5.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.1.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.2. Europe

11.2.1. Market Revenue and Forecast, by Product (2019-2030)

11.2.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.2.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.2.4. UK

11.2.4.1. Market Revenue and Forecast, by Product (2019-2030)

11.2.4.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.2.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.2.5. Germany

11.2.5.1. Market Revenue and Forecast, by Product (2019-2030)

11.2.5.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.2.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.2.6. France

11.2.6.1. Market Revenue and Forecast, by Product (2019-2030)

11.2.6.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.2.6.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.2.7. Rest of Europe

11.2.7.1. Market Revenue and Forecast, by Product (2019-2030)

11.2.7.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.2.7.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.3. APAC

11.3.1. Market Revenue and Forecast, by Product (2019-2030)

11.3.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.3.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.3.4. India

11.3.4.1. Market Revenue and Forecast, by Product (2019-2030)

11.3.4.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.3.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.3.5. China

11.3.5.1. Market Revenue and Forecast, by Product (2019-2030)

11.3.5.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.3.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.3.6. Japan

11.3.6.1. Market Revenue and Forecast, by Product (2019-2030)

11.3.6.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.3.6.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.3.7. Rest of APAC

11.3.7.1. Market Revenue and Forecast, by Product (2019-2030)

11.3.7.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.3.7.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.4. MEA

11.4.1. Market Revenue and Forecast, by Product (2019-2030)

11.4.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.4.4. GCC

11.4.4.1. Market Revenue and Forecast, by Product (2019-2030)

11.4.4.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.4.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.4.5. North Africa

11.4.5.1. Market Revenue and Forecast, by Product (2019-2030)

11.4.5.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.4.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.4.6. South Africa

11.4.6.1. Market Revenue and Forecast, by Product (2019-2030)

11.4.6.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.4.6.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.4.7. Rest of MEA

11.4.7.1. Market Revenue and Forecast, by Product (2019-2030)

11.4.7.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.4.7.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.5. Latin America

11.5.1. Market Revenue and Forecast, by Product (2019-2030)

11.5.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.5.4. Brazil

11.5.4.1. Market Revenue and Forecast, by Product (2019-2030)

11.5.4.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.5.4.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

11.5.5. Rest of LATAM

11.5.5.1. Market Revenue and Forecast, by Product (2019-2030)

11.5.5.2. Market Revenue and Forecast, by Dimension (2019-2030)

11.5.5.3. Market Revenue and Forecast, by Supply Chain Process (2019-2030)

Chapter 12. Company Profiles

12.1. Tokyo Electron Limited

12.1.1. Company Overview

12.1.2. Product Offerings

12.1.3. Financial Performance

12.1.4. Recent Initiatives

12.2. Applied Materials, Inc.

12.2.1. Company Overview

12.2.2. Product Offerings

12.2.3. Financial Performance

12.2.4. Recent Initiatives

12.3. ASML

12.3.1. Company Overview

12.3.2. Product Offerings

12.3.3. Financial Performance

12.3.4. Recent Initiatives

12.4. LAM RESEARCH CORPORATION

12.4.1. Company Overview

12.4.2. Product Offerings

12.4.3. Financial Performance

12.4.4. Recent Initiatives

12.5. Canon Inc

12.5.1. Company Overview

12.5.2. Product Offerings

12.5.3. Financial Performance

12.5.4. Recent Initiatives

Chapter 13. Research Methodology

13.1. Primary Research

13.2. Secondary Research

13.3. Assumptions

Chapter 14. Appendix

14.1. About Us

14.2. Glossary of Terms

Thanks for reading you can also get individual chapter-wise sections or region-wise report versions such as North America, Europe, or the Asia Pacific.

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